Polypropylene-Based Resin Expanded Beads, Method for Preparing Same, and Polypropylene-Based Resin Expanded Beads Molded Article
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United States of America Patent
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Issued Date -
Jan 1, 2015
app pub date -
Dec 6, 2012
filing date -
Dec 27, 2011
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Abandoned
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Abstract
An electrostatic dissipative, polypropylene-based resin expanded bead containing electrically conductive carbon black, having an apparent density of 10 to 120 kg/m3 and formed of a base resin which includes a polypropylene resin forming a continuous phase, and a polyethylene resin forming dispersed phases dispersed in the continuous phase, with the carbon black being unevenly distributed to the dispersed phases side. The polyethylene resin is an ethylene homopolymer or a copolymer of ethylene and C4 to C6 α-olefin and a weight ratio of the polypropylene resin to the polyethylene resin is 99.5:0.5 to 65:35. A molded article obtained by in-mold molding of such expanded beads exhibits electrostatic dissipative properties with a surface resistivity in the range of 1×105 to 1×1010Ω in a stable manner.
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