CHIP CARD AND ASSOCIATED MANUFACTUING METHOD
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United States of America Patent
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N/A
Issued Date -
Jan 1, 2015
app pub date -
Dec 24, 2012
filing date -
Dec 22, 2011
priority date (Note) -
Abandoned
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Abstract
The embodiments of this invention relate to a smart card (1) comprising the following:—an integrated circuit chip (10),—a primary card body (3) with a first form factor, comprising a slot (5) on the front (7) designed to accommodate the integrated circuit chip (10), wherein the said primary card body (3) also comprises a detachable contour (c1), peripheral to the slot (5), which represents another form factor and defines a secondary card body (11), characterised in that the primary card body (3) has a first thickness (el), between the front (7) and a back (8), and in that the secondary card body (11) has a second thickness (e2), between a front (7, 12) and a back (14), which is smaller than the first thickness (el).
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