Insulating Adhesive Composition for Metal-Based Copper Clad Laminate (MCCL), Coated Metal Plate Using Same, and Method for Manufacturing Same
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Dec 21, 2012
filing date -
Dec 28, 2011
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Abandoned
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Abstract
The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.
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