PHOTONIC INTEGRATED CIRCUIT AND FABRICATION PROCESS
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United States of America Patent
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app pub date -
Jun 23, 2014
filing date -
Jun 24, 2013
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Abstract
A photonic integrated circuit may include a silicon layer including a waveguide and at least one other photonic component. The photonic integrated circuit may also include a first insulating region arranged above a first side of the silicon layer and encapsulating at least one metallization level, a second insulating region arranged above a second side of the silicon layer and encapsulating at least one gain medium of a laser source optically coupled to the waveguide.
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