METHOD FOR STRENGTHENING SEMICONDUCTOR MANUFACTURING TOOLS
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Jul 23, 2013
filing date -
Jun 19, 2013
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Abandoned
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Abstract
A method for strengthening semiconductor manufacturing tools is provided. The method includes providing a mold insert, forming a native oxide layer, attaching a release agent film, and forming a glass bonded SiOx release agent layer. With the method, a firm glass bonded SiOx release agent layer is formed uniformly on the surface of the mold insert to make the mold insert of semiconductor manufacturing tools much more resistant to abrasion and durable, extend the service life of the mold insert, cut production costs of semiconductor manufacturing, enable easy release of the mold insert, and speed up semiconductor manufacturing. Furthermore, the uniformity of the glass bonded SiOx release agent layer on the surface of the mold insert helps promote the yield when making sub-molds by the mold insert.
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