COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jun 6, 2014
filing date -
Aug 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Importance

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Abstract
A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
AMPHENOL THERMOMETRICS INC | 967 WINDFALL ROAD ST MARYS PA 15857-3397 |
International Classification(s)

- 2014 Application Filing Year
- H01L Class
- 23828 Applications Filed
- 21803 Patents Issued To-Date
- 91.51 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
COOKSON, Terry L | Hayward, US | 1 | 2 |
# of filed Patents : 1 Total Citations : 2 | |||
GAMAGE, Sisira K | Palo Alto, US | 2 | 5 |
# of filed Patents : 2 Total Citations : 5 | |||
HOLLIS, Ronald A | Pleasant Grove, US | 1 | 2 |
# of filed Patents : 1 Total Citations : 2 | |||
LOGAN, Elizabeth A | Danville, US | 5 | 198 |
# of filed Patents : 5 Total Citations : 198 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 7.09 % this patent is cited more than
- 11 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 25, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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