Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Jun 24, 2013
filing date -
Jun 24, 2013
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Abstract
Standard solder-based interconnect structures are utilized as mechanical fasteners to attach an IC die in a “flip-chip” orientation to a support structure (e.g., a package base substrate or printed circuit board). Electrical connections between the support structure and the IC die are achieved by curved micro-springs that are disposed in peripheral regions of the IC die and extend through a gap region separating the upper structure surface and the processed surface of the IC die. The micro-springs are fixedly attached to one of the support structure and the IC die, and have a free (tip) end that contacts an associated contact pad disposed on the other structure/IC die. Conventional solder-based connection structures (e.g., solder-bumps/balls) are disposed on “dummy” (non-functional) pads disposed in a central region of the IC die. After placing the IC die on the support structure, a standard solder reflow process is performed to complete the mechanical connection.
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