COMPOSITION FOR FORMING PASSIVATION FILM, INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Feb 8, 2013
filing date -
Feb 9, 2012
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Abandoned
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Abstract
There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i):
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