COMPOSITION FOR FORMING PASSIVATION FILM, INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND

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United States of America Patent

APP PUB NO 20140374887A1
SERIAL NO

14374668

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Abstract

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There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i):

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Patent Owner(s)

Patent OwnerAddress
NISSAN CHEMICAL INDUSTRIES LTD7-1 KANDA-NISHIKI-CHO 3-CHOME CHIYODA-KU TOKYO 1010054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Tomoyuki Toyama-shi, JP 49 343
Ogino, Hiroshi Toyama-shi, JP 99 641
Tamura, Mamoru Toyama-shi, JP 45 230

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