METHOD FOR REMOVING SOLDER BALLS FROM CHIP
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Nov 8, 2012
filing date -
Dec 29, 2011
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Abstract
A method for removing solder balls (103) from a chip (102) comprises: immersing a chip (102) provided with solder balls (103) in a corrosive solution, the corrosive solution being prepared with a nitric acid solution having a concentration of 70% and deionized water at a volume ratio of 1:1 (301); taking out the chip (102) for rinsing (302); and placing the chip (102) into a container filled with water for ultrasonic oscillation cleaning (303). The corrosive solution prepared with a nitric acid solution having a concentration of 70% and deionized water at a volume ratio of 1:1 can completely remove the solder balls (103) from the surface of the chip (102) without affecting pads (201).
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