Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials

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United States of America Patent

APP PUB NO 20140368992A1
SERIAL NO

13918824

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat generating components using thermoplastic and/or self-healing thermal interface materials. In an exemplary embodiment, a thermal interface material has a softening or melting temperature above a normal operating temperature of the one or more heat generating components. The thermal interface material is flowable to a thin bond line between a heat spreader or lid and one or more heat generating components when heated to at least the softening or melting temperature while under pressure.

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Patent Owner(s)

Patent OwnerAddress
LAIRD TECHNOLOGIES INC3481 RIDER TRAIL SOUTH EARTH CITY MO 63045

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hill, Richard F Parkman, US 44 933
Strader, Jason L Cleveland, US 46 455

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