APPARATUS AND METHOD FOR POLISHING WAFER
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United States of America Patent
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Issued Date -
Dec 11, 2014
app pub date -
Dec 14, 2012
filing date -
Dec 16, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is an apparatus for polishing a wafer. The apparatus for polishing a wafer include a surface plate, a polishing pad disposed on the surface plate, the polishing pad including a plurality of fixed polishing particles, a head part disposed on the polishing pad, a retainer mounted on an outer surface of the head part, and a dressing part mounted a lower end of the support part, the dressing part having a ring shape.
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