SUBSTRATE TREATING APPARATUS AND METHOD OF TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20140363903A1
SERIAL NO

13914098

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Abstract

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A substrate treating apparatus including: a chamber capable of accommodating a substrate; a treating part which conducts a predetermined treatment associated with forming a coating film containing a metal to the substrate accommodated in the chamber; and a detection part which detects a concentration of a predetermined gas containing a chalcogen element within a gas inside the chamber.

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Patent Owner(s)

Patent OwnerAddress
TOKYO OHKA KOGYO CO LTD150 NAKAMARUKO NAKAHARA-KU KANAGAWA KAWASAKI-SHI 211-0012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Yubun Hillsboro, US 5 3
Masu, Yoshiaki Kawasaki-shi, JP 4 7
Miyamoto, Hidenori Hillsboro, US 194 2107
Sahoda, Tsutomu Kawasaki-shi, JP 20 105

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