Laminate Structure

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United States of America Patent

APP PUB NO 20140363628A1
SERIAL NO

14368314

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laminate structure (1) includes an article (10) having a microrelief structure (16) on the surface thereof, and an adhesive film (20) being in contact with the microrelief structure (16)-side surface of the article (10), in which an average interval between projection portions (14) in the microrelief structure (16) is 400 nm or less, a low-speed peeling strength of the adhesive film (20) to an acrylic resin plate measured by a specific method based on JIS Z0237:2009 is 0.01 N/25 mm or more and less than 2.5 N/25 mm, and a ratio between a high-speed peeling strength and the low-speed peeling strength (high-speed peeling strength/low-speed peeling strength) of the adhesive film (20) to the acrylic resin plate is less than 2.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI RAYON CO LTDTOKYO 100-8253

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Makino, Shinji Otake-shi, JP 43 328
Nakai, Yusuke Otake-shi, JP 51 146

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