Communication system die stack
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United States of America Patent
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Jul 28, 2015
Grant Date -
Dec 11, 2014
app pub date -
Jun 10, 2013
filing date -
Jun 10, 2013
priority date (Note) -
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Abstract
A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable MEMS optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each MEMS optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.
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