Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SONY CORPORATION	TOKYO JAPAN

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
• B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Augustin, Andreas	Munich, DE	36	225
Geissler, Christian	Teugn, DE	62	676
Mahnkopf, Reinhard	Oberhaching, DE	33	316
Meyer, Thorsten	Regensburg, DE	309	5595
Mueller, Christian	Bottrop, DE	165	1577
Ofner, Gerald	Regensburg, DE	59	1274

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 2, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 2, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 02, 2018	US,9856136,B2   US9856136B2	GRANTED PATENT AS SECOND PUBLICATION
December 11, 2014	US,20140361387,A1   US20140361387A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2014/0361,387

CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

---

 

Legal Events