HEAT-DISSIPATING ASSEMBLY FOR ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Dec 11, 2014
app pub date -
Jun 9, 2014
filing date -
Jun 8, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat-dissipating assembly for electronic component is provided, which comprises a body and at least one insert element. The body has a front surface and a back surface opposite to each other, two side surfaces opposite to each other, and at least one through-hole which penetrates the two side surfaces. Each of the insert elements is detachably inserted into the at least one through-hole respectively, and is provided with at least one internal thread hole which is formed from the front surface to the back surface of the body. The heat-dissipating assembly for electronic component according to the present disclosure may be used easily and flexibly, benefits in reducing space to be occupied.
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