METHOD AND DEVICE FOR BONDING OF SUBSTRATES
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United States of America Patent
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Issued Date -
Dec 11, 2014
app pub date -
Dec 28, 2011
filing date -
Dec 28, 2011
priority date (Note) -
Abandoned
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Abstract
A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate.
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