WAFER CARRIER HAVING THERMAL UNIFORMITY-ENHANCING FEATURES
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United States of America Patent
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Issued Date -
Dec 11, 2014
app pub date -
Jun 5, 2014
filing date -
Jun 5, 2013
priority date (Note) -
Abandoned
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Abstract
A wafer carrier assembly for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition (CVD), the wafer carrier assembly includes a wafer carrier body formed symmetrically about a central axis, and including a generally planar top surface that is situated perpendicularly to the central axis and a planar bottom surface that is parallel to the top surface. At least one wafer retention pocket is recessed in the wafer carrier body from the top surface. Each of the at least one wafer retention pocket includes a floor surface and a peripheral wall surface that surrounds the floor surface and defines a periphery of that wafer retention pocket. At least one thermal control feature includes an interior cavity or void formed in the wafer carrier body and is defined by interior surfaces of the wafer carrier body.
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