Microspeaker with Improved Soldering Structure
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United States of America Patent
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Issued Date -
Dec 4, 2014
app pub date -
May 27, 2014
filing date -
May 28, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microspeaker is provided with a soldering structure which can overcome a process defect or a progressive defect during the soldering of a terminal pad and a suspension. A sound transducer has a frame, a magnetic circuit, a voice coil and a diaphragm, the microspeaker with an improved soldering structure, and including: a suspension guiding a vibrating direction of the diaphragm and the voice coil, made of a conductive material to apply electrical signals to the voice coil, and having a through hole at its corners; and a terminal pad secured to the frame, one end of which is brought into contact with a terminal outside of the sound transducer, the other end of which passes through the through hole of the suspension.
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