HEADPHONES AND HEADPHONE DRIVER
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United States of America Patent
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N/A
Issued Date -
Dec 4, 2014
app pub date -
Dec 21, 2012
filing date -
Dec 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
[Problem] To provide headphones that can be inexpensively manufactured without requiring any high-level manufacturing technology in terms of manufacturing of a diaphragm, and is capable of reproducing an audio signal without sound deterioration in a wide range of frequency band by minimizing resonant frequencies at high frequencies. [Solution] For headphones that are equipped with two headphone driver units, ear pads that are provided on the head-phone driver units, and a headphone band for connecting the two headphone driver units together, each headphone driver unit is equipped with a headphone driver comprising a diaphragm, a voice coil which is fixed to the diaphragm, a magnet which is positioned next to the voice coil, a yoke which is provided opposite to the magnet via a voice coil, and a frame for mounting the magnet and the yoke and for fixing a periphery section of the diaphragm, wherein the diaphragm is molded by using a mixture of a paper material and a nanofiber material.
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