Embedded Heat Slug to Enhance Substrate Thermal Conductivity
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United States of America Patent
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Issued Date -
Dec 4, 2014
app pub date -
Jun 3, 2013
filing date -
May 31, 2013
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Abstract
An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate. Thermal paths to the heat slug are linked through the ground signal interconnects (traces, vias and planes).
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