METHOD AND SYSTEM FOR FORMING HIGH ACCURACY PATTERNS USING CHARGED PARTICLE BEAM LITHOGRAPHY

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United States of America Patent

APP PUB NO 20140353526A1
SERIAL NO

14454140

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Abstract

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A method and system for fracturing or mask data preparation for charged particle beam lithography are disclosed in which a plurality of charged particle beam shots is determined that will form a pattern on a surface using a multi-beam charged particle beam writer, where the sensitivity of the pattern on the surface to manufacturing variation is reduced by increasing edge slope.

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Patent Owner(s)

Patent OwnerAddress
D2S INC4040 MOORPARK AVE SUITE 250 SAN JOSE CA 95117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimura, Akira Saratoga, US 225 2554

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