ELECTROMAGNETIC HYPERTHERMIA ASSEMBLY
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United States of America Patent
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Issued Date -
Nov 27, 2014
app pub date -
May 19, 2014
filing date -
May 21, 2013
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Abstract
An electromagnetic hyperthermia assembly includes: a substrate; a plurality of hyperthermia needles each having a needle portion that extends through and downwardly from the substrate and that has a needle tip distal from the substrate; and a guiding plate having a plurality of through holes. The needle portions of the hyperthermia needles respectively and removably extend through the through holes such that the guiding plate is movable along the needle portions and between the substrate and the needle tips of the needle portions. The through holes keep the needle tips spaced apart from each other at predetermined positions.
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