Surface mountable electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10629485
APP PUB NO 20140346642A1
SERIAL NO

14342999

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Importance

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Abstract

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A surface mountable electronic component free of connecting wires comprises a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the underside of the component. The component comprises at least one recess is formed in the region of the edges bounding the underside; and in that the recess is covered with an insulating layer. A method for the manufacture of such a component comprises the formation of corresponding recesses.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
VISHAY SEMICONDUCTOR GMBHHEILBRONN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mähner, Claus Heilbronn, DE 1 1

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