POLISHING PAD
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United States of America Patent
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Issued Date -
Nov 20, 2014
app pub date -
Dec 14, 2012
filing date -
Dec 16, 2011
priority date (Note) -
Abandoned
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Abstract
An object of the present invention is to provide a polishing pad which hardly generates scratches on the surface of an object to be polished, and has improved dressability. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the polishing pad. A polishing pad of the present invention includes a polishing layer made of a fine cell-containing polyurethane resin foam, wherein the polyurethane resin foam contains a polyurethane resin having an Asker D hardness of 20 to 60 degrees and an abrasion parameter, which is expressed by the following equation, of 1 to 3.
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