Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same

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United States of America Patent

APP PUB NO 20140342161A1
SERIAL NO

14352893

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Abstract

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Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

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Patent Owner(s)

Patent OwnerAddress
SHENGYI TECHNOLOGY CO LTDNO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zeng, Xianping Dongguan, CN 29 83

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  • 3 Citation Count
  • C08G Class
  • 13.62 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1406831194019963112501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750

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