DUAL-SIDE WAFER BAR GRINDING
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United States of America Patent
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Issued Date -
Nov 20, 2014
app pub date -
May 20, 2013
filing date -
May 20, 2013
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Abandoned
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Abstract
A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.
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