BENDABLE HEAT READIATING COMPOSITE AND BACKLIGHT UNIT HAVING THE SAME
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United States of America Patent
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May 20, 2013
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May 20, 2013
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Abstract
A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided.
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