INTERLEAVED PLANAR INDUCTIVE DEVICE AND METHODS OF MANUFACTURE AND USE
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United States of America Patent
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Issued Date -
Nov 20, 2014
app pub date -
Apr 2, 2014
filing date -
Apr 10, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A low cost, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes an interleaved flat coil arrangement that ensures low leakage inductance while using a smaller number of flat coil windings compared to prior art devices. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.
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