DESMEAR SOLUTION AND DESMEAR METHOD
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United States of America Patent
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Issued Date -
Nov 20, 2014
app pub date -
Sep 11, 2012
filing date -
Sep 22, 2011
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Abstract
The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
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