Process For Texturing The Surface Of A Silicon Substrate, Structured Substrate And Photovoltaic Device Comprising Such A Structured Substrate
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United States of America Patent
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Nov 20, 2014
app pub date -
Dec 20, 2012
filing date -
Dec 22, 2011
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Abstract
The invention relates to a process for texturing the surface of a silicon substrate, comprising a step of exposing said surface to an MDECR plasma generated, at least from argon, using between 1.5 W/cm2 and 6.5 W/cm2 of plasma power in a matrix distributed electron cyclotron resonance plasma source, the substrate bias being between 100 V and 300 V.
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