Quad Flat No-Lead Integrated Circuit Package and Method for Manufacturing the Package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140332940A1
SERIAL NO

13932796

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Abstract

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A quad flat no-lead (QFN) integrated circuit package is provided.

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Patent Owner(s)

Patent OwnerAddress
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO LTD555-9 BAEKSEOK-DONG CHEONAN CHUNGCHEONGNAM-DO 331-220

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SON, Jong Myoung Cheonan-si, KR 2 0

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