Via Fill Material For Solar Applications

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United States of America Patent

APP PUB NO 20140332067A1
SERIAL NO

13819862

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is directed toward a via fill material for use in solar applications that exhibits low series resistance and high shunt resistance. The via fill material according to the invention includes silver powder, a glass frit and a vehicle.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC24 UNION HILL ROAD WEST CONSHOHOCKEN PA 19428

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Graddy,, JR George E Del Mar, US 8 48
McKinley, Caroline M Oceanside, US 1 8
Shaikh, Aziz S San Diego, US 44 630

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