Micro inductive sensor
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United States of America Patent
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Jun 25, 2019
Grant Date -
Nov 6, 2014
app pub date -
May 5, 2014
filing date -
May 3, 2013
priority date (Note) -
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Abstract
An inductive sensor includes a sensor package and a coupler package. The sensor package includes a signal processor, an integrated capacitor, a ferrite layer, a transmitter coil, a two part receiving coil, and a plurality of discrete components. The coupler package includes an integrated capacitor, a ferrite layer, and a coupler coil. The transmitter coil in the sensor package is energized by an external power source which in turn energizes the coupler coil in the coupler package. The sensor then measures the rotational position of the coupler package relative to the sensor package by detecting and measuring, with the two part receiving coil, the signal returned by the coupler coil. The signal processor calculates the position of the coupler package relative to the sensor package by comparing the coupling factors between the coupler package and the sensor package.
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