SEMICONDUCTOR STRUCTURE FOR ELECTROMAGNETIC INDUCTION SENSING AND A METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20140327094A1
SERIAL NO

13966569

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Abstract

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A semiconductor structure for electromagnetic induction sensing and a method for manufacturing the same are provided: forming the Hall sensor in a first semiconductor fabrication; forming the passivation layer above the Hall sensor to cover the Hall sensor according to the first semiconductor fabrication; and forming the current-carrying layer above the passivation layer in a second semiconductor fabrication to form the semiconductor structure for electromagnetic induction sensing. The current-carrying layer carries the current to be sensed; and the Hall sensor senses the magnetic field generated. The Hall sensor generates a voltage or a current signal proportional to the strength of the current to be sensed.

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Patent Owner(s)

Patent OwnerAddress
FEELING TECHNOLOGY CORP2FL-2 NO 287 SEC 2 GUANGFU RD HSINCHU R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, HSUAN-CHUAN HSINCHU, TW 10 11
LIN, TENG-TSAI HSINCHU, TW 6 7
SU, WEN-JUNG HSINCHU, TW 6 53

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