Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks

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United States of America Patent

APP PUB NO 20140326607A1
SERIAL NO

14203409

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Abstract

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Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

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Patent Owner(s)

Patent OwnerAddress
MICROFABRICA INC7911 HASKELL AVENUE VAN NUYS CA 91406

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cohen, Adam L Dallas, US 257 5746
Frodis, Uri Los Angeles, US 61 889
Kilgo,, III Marvin M Oakland, US 8 14
Lockard, Michael S Lake Elizabeth, US 160 3821
Smalley, Dennis R Newhall, US 214 7959
Thomassian, Jill R Los Angeles, US 5 120

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