HIGH PERFORMANCE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Nov 6, 2014
app pub date -
Aug 27, 2012
filing date -
Aug 25, 2011
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Abstract
A printed circuit board for carrying high frequency signals. Conducting structures of the printed circuit board are shaped within breakout regions to limit impedance discontinuities in the signal paths between vias and conductive traces within the printed circuit board. Values of parameters of traces or anti-pads, for example, may be adjusted to provide a desired impedance. The specific values selected as part of designing a printed circuit board may match the impedance of the breakout region to that of the via. The parameters for which values are selected may include the trace width, thickness, spacing, length over an anti-pad or angle of exit from the breakout region.
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