THERMAL-SHOCK-RESISTANT CURED PRODUCT AND METHOD FOR PRODUCING SAME
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United States of America Patent
Stats
-
N/A
Issued Date -
Oct 30, 2014
app pub date -
Aug 29, 2012
filing date -
Sep 1, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is a method for producing a thermal-shock-resistant cured product, the method involving: a condensation step of preparing a cured-product precursor by subjecting monomers represented by general formulae (1) to (5) to copolycondensation at a specific rate in the presence of an acid catalyst; and a curing step of curing the cured-product precursor by polymerizing at least a portion of ethylenically unsaturated bonds in the cured-product precursor. Also, the present invention is a cured product prepared by said method. (In formulae (1) to (5): (X) is a siloxane bond producing group; R1, R2, and R4 are each a group selected from among a hydrogen atom, an alkyl group, an aralkyl group, a cycloalkyl group, a cycloaralkyl group, an aryl group, and a group having an ethylenically unsaturated bond; R3 and R5 are each a group selected from among a hydrogen atom, an alkyl group, an aralkyl group, a cycloalkyl group, a cycloaralkyl group, and an aryl group; and at least one of R1, R2, and R4 is a group having an ethylenically unsaturated bond.)
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TOAGOSEI CO LTD | 1-14-1 NISHI-SHIMBASHI MINATO-KU TOKYO 105-8419 |
International Classification(s)

- 2012 Application Filing Year
- C08G Class
- 2008 Applications Filed
- 1741 Patents Issued To-Date
- 86.71 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Furuta, Naomasa | Aichi, JP | 12 | 16 |
# of filed Patents : 12 Total Citations : 16 | |||
Kitamura, Akinori | Aichi, JP | 36 | 316 |
# of filed Patents : 36 Total Citations : 316 |
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Patent Citation Ranking
- 2 Citation Count
- C08G Class
- 13.62 % this patent is cited more than
- 11 Age
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 30, 2026 |
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