SEMICONDUCTOR-ON-INSULATOR STRUCTURE AND PROCESS FOR PRODUCING SAME
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United States of America Patent
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Issued Date -
Oct 30, 2014
app pub date -
Nov 2, 2012
filing date -
Nov 7, 2011
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Abandoned
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Abstract
A semiconductor-on-insulator structure, including a semiconductor thin film having electronic devices formed therein, the semiconductor thin film being disposed on a first face of an electrically insulating thin film; wherein to reduce parasitic capacitance, there is no bulk substrate attached to a second face of the electrically insulating thin film opposite to the first face, and to provide a path for heat flow from the devices, the thermal conductivity of the electrically insulating thin film is substantially greater than 1.4 W·m−1·K−1.
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