Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector
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United States of America Patent
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Issued Date -
Oct 30, 2014
app pub date -
Feb 13, 2014
filing date -
Feb 22, 2013
priority date (Note) -
Abandoned
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Abstract
A device is provided which includes (a) a thermally conductive base having first and second major surfaces; (b) a die attached to said first major surface of said base; (c) a heat pipe having a first end which is attached to said second major surface of said base; (d) a plurality of heat fins attached to a second end of said heat pipe; and (e) at least one synthetic jet ejector disposed between said base and said plurality of heat fins.
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