NANOPARTICLE COMPACT MATERIALS FOR THERMOELECTRIC APPLICATION

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United States of America Patent

APP PUB NO 20140318593A1
SERIAL NO

14359817

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Abstract

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A thermoelectric composite and a thermoelectric device and a method of making the thermoelectric composite. The thermoelectric composite is a semiconductor material formed from mechanically-alloyed powders of elemental constituents of the semiconductor material to produce nano-particles of the semiconductor material, and compacted to have at least a bifurcated grain structure. The bifurcated grain structure has at least two different grain sizes including small size grains in a range of 2-200 nm and large size grains in a range of 0.5 to 5 microns. The semiconductor material has a figure of merit ZT, defined as a ratio of the product of square of Seebeck coefficient, S2, and electrical conductivity σ divided by the thermal conductivity k, which varies from greater than 1 at 300 K to 2.5 at temperatures of 300 to 500K.

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Patent Owner(s)

Patent OwnerAddress
MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC3021 E CORNWALLIS ROAD DURHAM NC 27709

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Tsungta Ethan Raleigh, US 1 12
Koch, Carl C Raleigh, US 7 200
Stuart, Judy Apex, US 2 13
Thomas, Peter Raleigh, US 77 1132
Venkatasubramanian, Rama Cary, US 51 1168
Wiitala, Ryan Morrisville, US 1 12

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