Sintering Metallic Inks on Low Melting Point Substrates
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Oct 5, 2012
filing date -
Oct 5, 2011
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Abstract
Tape lamination on a dry copper ink film, followed by a flash lamp procedure, produces conductive films. The tape lamination increases the curing parameter window and reduces crack formation in the metallic film Tape lamination facilitates curing of a continuous copper film on temperature sensitive substrates, such as PET, at power levels that would usually crack blow off the copper film This lamination process also improves adhesion and uniformity of the cured film.
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