COMPOSITE ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Apr 21, 2014
filing date -
Apr 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.
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