POWER STACK STRUCTURE AND METHOD
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Nov 4, 2011
filing date -
Nov 4, 2011
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Abandoned
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Abstract
A power conversion apparatus includes plural press-pack power semiconductor devices; plural thermal and electric conducting blocks provided among the plural press-pack power semiconductor devices; and plural bus bars provided among the plural press-pack power semiconductor devices and the plural thermal and electric conducting blocks to form a first column that is clamped under a predetermined mechanical force. The plural bus bars are directly pressed in the first or more columns for electrical connection, at least one of the press-pack power semiconductor devices is sandwiched between two thermal and electrical conducting blocks, and at least one of the bus bars is sandwiched between two thermal and electric conducting blocks. A method for assembling the power conversion apparatus is also provided. The apparatus and the method can provide optimum heat transfer for press-pack power semiconductor devices and minimum commutation loss and stress.
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