BOARD, MOUNTING STRUCTURE OF SURFACE MOUNTING COMPONENT, AND ELECTRONIC DEVICE

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United States of America Patent

SERIAL NO

14319467

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Abstract

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A mounting structure of a surface mounting component is configured by connecting the surface mounting component to a board at the vicinity of an end portion by soldering. A concave portion is formed between joint portions for the soldering in a range in which the surface mounting component of the board is mounted.

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Patent Owner(s)

Patent OwnerAddress
LENOVO INNOVATIONS LIMITED (HONG KONG)QUARRY BAY HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUSAWA, Koji Tokyo, JP 17 149
YUGAMI, Kazuyuki Tokyo, JP 5 19

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