Resin Composition For Sealant, Laminated Film, And Packaging Bag

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140308466A1
SERIAL NO

14360076

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a resin composition for a sealant capable of improving non-adsorption properties and heat sealing properties with respect to an organic component in an article contained, a laminated film and a packaging bag. The resin composition for a sealant of the invention is made of a resin obtained by blending a cycloolefin polymer (COP), a cycloolefin copolymer (COC) and polyethylene (PE), and the blending ratio is 42 weight % to 98 weight % of the cycloolefin polymer (COP), 1 weight % to 49 weight % of the cycloolefin copolymer (COC) and 1 weight % to 19 weight % of the polyethylene (PE).

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Patent Owner(s)

Patent OwnerAddress
FUJIMORI KOGYO CO LTD1-1-1 KOISHIKAWA BUNKYO-KU TOKYO 1120002 ?1120002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inada, Masakazu Kagoshima-shi, JP 5 22
Kashima, Kousuke Yokosuka-shi, JP 6 12
Okamoto, Hajime Yokohama-shi, JP 27 192
Yoshida, Mihoko Chiba-shi, JP 4 14

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