WAFER-LEVEL FABRICATION OF OPTICAL DEVICES, IN PARTICULAR OF MODULES FOR COMPUTATIONAL CAMERAS
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United States of America Patent
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Oct 16, 2014
app pub date -
Aug 24, 2012
filing date -
Aug 25, 2011
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Abstract
The device (50) comprises an optics member (60) and a spacer member (70), said optics member comprising N≧2 sets of passive optical components (65) comprising one or more passive optical components each. The spacer member (70) comprises N light channels (77), each of said N light channels being associated with one of said N sets of passive optical components. All of said N light channels (77) have an at least substantially identical geometrical length (g), and an optical path length of a first of said N light channels is different from an optical path length of at least one second of said N light channels. Methods for manufacturing such devices are described, too. The invention can allow to mass produce high-precision devices (50) at a high yield.
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