MULTILAYER PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
Oct 16, 2014
app pub date -
Apr 13, 2012
filing date -
Apr 15, 2011
priority date (Note) -
Abandoned
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Abstract
The invention relates to a multilayer structure produced by moulding and intended to form at least one part of the packaging wall, said structure comprising an oxygen barrier layer, referred to as a “passive layer”, composed of a resin that is a barrier to oxygen, and another layer, referred to as to an “active layer”, composed of at least one resin that is permeable to oxygen and in which oxygen absorbers are dispersed. The invention also relates to packaging comprising said multilayer structure.
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