COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME
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United States of America Patent
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Issued Date -
Oct 16, 2014
app pub date -
Oct 22, 2013
filing date -
Nov 9, 2012
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Abandoned
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Abstract
A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity, and high thermal stability as a material for information transmission and electrical contact of connectors or the like for home appliances and automobiles, including semiconductor lead frames and a method of preparing the same are disclosed.
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